Patent Assignment
Reel/Frame 026174/0287
Assignment of Assignor's Interest
Recorded: 2011-04-06
Pages: 3
Assignors
CHEN, CHIEN-WEN
Executed: 2011-02-17
ZU, LONGQIANG
Executed: 2011-02-17
TSAI, CHEN-FA
Executed: 2011-03-03
Assignee
GLOBAL UNICHIP CORPORATION
NO. 10, LI-HSIN 6TH RD., HSINCHU, SCIENCE PARK, HSINCHU CITY 300, R.O.C., TAIWAN
Covered Property
(1)
Method for Packaging Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.