Assignment of Assignor's Interest

Recorded: 2011-03-09 Pages: 3

Assignors

CHEN, CHIEN-WEN

Executed: 2011-02-24

KAO, CHIA-JEN

Executed: 2011-02-24

CHUANG, JUI-CHENG

Executed: 2011-02-24

Assignee

GLOBAL UNICHIP CORPORATION

NO. 10, LI-HSIN 6TH RD., HSINCHU, SCIENCE PARK, HSINCHU CITY 300, R.O.C., TAIWAN

Covered Property (1)

Method for Detecting the Under-Fill Void in Flip Chip Bga

Patent: 8,518,722 →

Application: 13/064,161 →

Publication: US 2012/0052603

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.