Patent Assignment
Reel/Frame 025784/0032
Assignment of Assignor's Interest
Recorded: 2011-02-07
Pages: 2
Assignor
SHIBUYA, KOUJIROU
Executed: 2010-12-15
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Property
(1)
Semiconductor Device, Semiconductor Package, Interposer, Semiconductor Device Manufacturing Method and Interposer Manufacturing Method