IP Library Assignment 025784/0054
Patent Assignment
Reel/Frame 025784/0054

Assignment of Assignor's Interest

Recorded: 2011-02-08 Pages: 5
Assignors
NANG, HNIN NWAY SAN
Executed: 2010-10-22
ARAI, KAZUYA
Executed: 2010-10-22
FUKUI, KEI
Executed: 2010-10-22
IKEGAMI, SHINPEI
Executed: 2010-10-22
TAKAHASHI, YASUHITO
Executed: 2010-10-21
YOSHIMURA, HIDEAKI
Executed: 2010-10-22
SUZUKI, HITOSHI
Executed: 2010-10-22
Assignee
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA 211-8588, JAPAN
Covered Property (1)
Package Substrate Unit and Method for Manufacturing Package Substrate Unit
Patent: 8,800,142 →
Application: 12/929,680 →
Publication: US 2012/0067635
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 8, 2020
From: FUJITSU LIMITED
To: FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
Reel/Frame 052345/0603 →