Patent Assignment
Reel/Frame 025805/0064
Assignment of Assignor's Interest
Recorded: 2011-02-16
Pages: 3
Assignors
PARK, JI-YONG
Executed: 2011-01-26
LEE, HEE-SEOK
Executed: 2011-01-26
KIM, CHUL-WOO
Executed: 2011-01-26
JO, SANG-GUI
Executed: 2011-01-26
BAE, KWANG-JIN
Executed: 2011-01-26
KIM, SEUNG-HWAN
Executed: 2011-01-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, SOUTH, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Having Interconnections, Openings, and Pads Having Greater Width Than the Openings