Electronic device having interconnections, openings, and pads having greater width than the openings

1. An electronic device, comprising:

first and second interconnections formed at a same vertical height on a first surface of a substrate and spaced apart from each other;

a first insulating material layer disposed on the substrate including the first and second interconnections and including a first opening exposing a predetermined region of the first interconnection; and

a first pad filling the first opening and having a greater width than the first opening, wherein the first pad vertically overlaps at least a part of the second interconnection adjacent to one end of the first interconnection, and the first pad is electrically insulated from the second interconnection by the first insulating material layer.

2. The device of claim 1 , wherein the first opening exposes an upper portion of one end of the first interconnection.

3. The device of claim 1 , wherein the first opening exposes an upper portion and sidewall of one end of the first interconnection.

4. The device of claim 1 , wherein the first opening is formed in a rectangular or oval shape having a major axis and a minor axis.

5. The device of claim 1 , wherein the first interconnection has an end including a bent portion, and the first opening exposes an upper portion of the bent portion of the first interconnection.

6. The device of claim 1 , wherein the first pad has a flat top surface that is raised above a top surface of the first insulating material layer.

7. The device of claim 1 , wherein the first pad has one of a swollen central portion or a recessed top surface.

8. The device of claim 1 , wherein the first insulating layer has a second opening exposing a predetermined region of the second interconnection, the electronic device further comprises a second pad filling the second opening, having a greater width than the second opening, and formed of the same material as the first pad, and when viewed from a plan view, a center point of the first opening is at a position not coincident with a center point of the first pad and a center point of the second opening overlaps a center point of the second pad.

9. An electronic device, comprising:

first and second interconnection formed on a first surface of a substrate and spaced apart from each other;

a first insulating material layer disposed on the substrate including the first and second interconnections and including a first opening exposing a predetermined regionn of the first interconnection; and

first pad filling the first opening and having a greater width than the first opening, wherein the first covers at least a part of the second interconnection adjacent to one end of the first interconnection, and the first pad is electrically insulated from the second interconnection by the first insulating material layer,

wherein the first and second interconnections are formed of a first conductive material and the first pad is formed of a second conductive material having a lower density than the first conductive material.

10. The device of claim 1 , wherein the first pad covers the one end of the first interconnection exposed by the first opening, extends to cross over the second interconnection adjacent to the one end of the first interconnection to cover the second interconnection, and is insulated from the second interconnection by the first insulating material layer.

11. The device of claim 1 , wherein the one end of the first interconnection has the same width as or a greater width than a middle portion of the first interconnection.

12. The device of claim 1 , wherein the first insulating layer has a second opening exposing a predetermined region of the second interconnection,

the electronic device further comprises a second pad filling the second opening, and when viewed from a plan view, the first and second openings have different shapes or sizes from each other.

13. The device of claim 1 , further comprising a second pad connected to the second interconnection,

wherein the first and second pads are pads formed by sintering a solution containing metal particles or metal powders and have a first particle size, and the first and second interconnections are interconnections formed of a conductive material having a second particle size formed by plating or depositing, the second particle size being smaller than the first particle size.

14. The device of claim 1 , further comprising a second pad connected to the second interconnection,

wherein the first and second pads have surfaces or cross-sections having a greater roughness than those of the first and second interconnections.

15. The device of claim 1 , further comprising:

a second pad connected to the second interconnection;

third and fourth pads formed on a second surface of the substrate opposite to the first surface and spaced apart from each other;

a second insulating material layer formed on the second surface of the substrate having the third and fourth pads, and having third and fourth openings respectively exposing the third and fourth pads;

first and second ball structures formed on the first and second pads; and

third and fourth ball structures formed on the third and fourth pads,

wherein a material constituting the first and second pads has a lower density than a material constituting the third and fourth pads.

16. An electronic device, comprising:

a substrate;

an interconnection formed on the substrate;

an insulating material layer covering the substrate having the interconnection and including an opening exposing a predetermined region of the interconnection;

a pad filling the opening, at least a portion of the pad having a greater width than a width of the predetermined region of the interconnection and being electrically connected to the interconnection; and

a ball structure on the pad,

wherein the pad is formed by coating a liquid-phase material containing metal particles or metal powders to cover the opening, and performing a sintering process for solidifying the coated material at a lower temperature than a melting point of the metal particles or metal powders, and

wherein interconnection is formed of a conductive material that has more densely packed particles than the solidified material that comprise the pad.

17. The device of claim 1 , wherein the first and second interconnections are formed of a first conductive material and the first pad is formed of a second conductive material having a lower density than the first conductive material.

18. The electronic device of claim 16 , further comprising:

an additional interconnection formed at a same vertical height on the substrate as the interconnection and spaced apart from the interconnection,

wherein the pad vertically overlaps at least a part of the additional interconnection.