Patent Assignment
Reel/Frame 025805/0826
Assignment of Assignor's Interest
Recorded: 2011-02-14
Pages: 4
Assignors
AHN, HEUI GYUN
Executed: 2011-02-08
OH, SE JUNG
Executed: 2011-02-08
JEON, IN GYUN
Executed: 2011-02-08
WON, JUN HO
Executed: 2011-02-08
Assignee
SILICONFILE TECHNOLOGIES, INC.
19F, DAECHI TOWER B/D, #891, DAECHI-DONG, GANGNAM-GU, SEOUL, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Forming Pad in Wafer with Three-Dimensional Stacking Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.