IP Library › Assignment 025866/0997
Patent Assignment
Reel/Frame 025866/0997

Assignment of Assignor's Interest

Recorded: 2011-02-25 Pages: 3
Assignors
CHEN, YU-WEN
Executed: 2011-02-10
HSIEH, CHUANG-HAN
Executed: 2011-02-10
LIN, KUN-YU
Executed: 2011-02-10
TSAI, KUAN-CHI
Executed: 2011-02-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property (1)
Preventing the Cracking of Passivation Layers on Ultra-Thick Metals
Patent: 8,860,224 →
Application: 13/035,517 →
Publication: US 2012/0217641
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 5, 2024
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC
Reel/Frame 068326/0474 →