Corrective Assignment to Correct the Assignment to Re-Record Assignment Previously Recorded on Reel 025695 Frame 0105. Assignor(S) Hereby Confirms the Correction of Patent No. 7779675 Recorded in Error to Patent No. 7799675.

Recorded: 2011-02-24 Pages: 6

Assignor

LEE, SANG-YUN

Executed: 2010-12-15

Assignee

BESANG INC.

1915 NW AMBERGLEN PKWY., SUITE 310, BEAVERTON, OREGON, 97006

Covered Property (1)

Bonded Semiconductor Structure and Method of Fabricating the Same

Patent: 7,799,675 →

Application: 12/475,294 →

Publication: US 2009/0325343

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.