Patent Assignment
Reel/Frame 045658/0353
Release of Security Interest
Recorded: 2018-04-27
Pages: 5
Assignor
DAEHONG TECHNEW CORPORATION
Executed: 2018-04-27
Assignee
BESANG INC.
1915 NW AMBERGLEN PARKWAY SUITE 400, BEAVERTON, OREGON, 97006
Covered Properties
(27)
Method for Making a Three-Dimensional Integrated Circuit Structure
Vertical Memory Device Structures
Wafer Bonding Method
Semiconductor Layer Structure and Method of Making the Same
Semiconductor Memory Device
Semiconductor bonding and layer transfer method
Application:
11/092,501 →
Publication:
US 2005/0280155
Electronic Circuit with Embedded Memory
Three-dimensional integrated circuit structure and method of making same
Application:
11/378,059 →
Publication:
US 2006/0275962
Three-Dimensional Integrated Circuit Structure
Electronic Circuit with Embedded Memory
Application:
11/873,719 →
Publication:
US 2008/0048327
Semiconductor Memory Device
Application:
11/873,769 →
Publication:
US 2008/0032463
Semiconductor Bonding and Layer Transfer Method
Semiconductor Circuit
Semiconductor Layer Structure and Method of Making the Same
Semiconductor Layer Structure and Method of Making the Same
Wafer Bonding Method
Semiconductor Circuit and Method of Fabricating the Same
Bonded Semiconductor Structure and Method of Making the Same
Bonded Semiconductor Structure and Method of Fabricating the Same
Information Storage System Which Includes a Bonded Semiconductor Structure
Semiconductor Memory Device
Electronic Circuit with Embedded Memory
Application:
12/637,559 →
Publication:
US 2010/0133695
Semiconductor Circuit Structure and Method of Forming the Same Using a Capping Layer
Semiconductor Circuit Structure and Method of Making the Same
Semiconductor Circuit
Semiconductor Structure and Method of Fabricating the Same
Application:
13/175,293 →
Publication:
US 2012/0003815
Semiconductor Memory Device and Method of Fabricating the Same
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 25, 2011
From: OH, CHOONSIK
To: BESANG, INC.
Reel/Frame 025694/0624 →
Assignment of Assignor's Interest
Jan 25, 2011
From: LEE, SANG-YUN
To: BESANG, INC.
Reel/Frame 025695/0105 →
Security Agreement
May 8, 2013
From: BESANG INC.
To: DAEHONG TECHNEW CORPORATION
Reel/Frame 030373/0668 →