Patent Assignment
Reel/Frame 025695/0105
Assignment of Assignor's Interest
Recorded: 2011-01-25
Pages: 4
Assignor
LEE, SANG-YUN
Executed: 2010-12-15
Assignee
BESANG, INC.
1915 NW AMBERGLEN PKWY., SUITE 310, BEAVERTON, OREGON, 97006
Covered Properties
(29)
Method for Making a Three-Dimensional Integrated Circuit Structure
Vertical Memory Device Structures
Wafer Bonding Method
Semiconductor Layer Structure and Method of Making the Same
Semiconductor Memory Device
Semiconductor bonding and layer transfer method
Application:
11/092,501 →
Publication:
US 2005/0280155
Electronic Circuit with Embedded Memory
Semiconductor Device with Base Support Structure
Three-dimensional integrated circuit structure and method of making same
Application:
11/378,059 →
Publication:
US 2006/0275962
Three-Dimensional Integrated Circuit Structure
Electronic Circuit with Embedded Memory
Application:
11/873,719 →
Publication:
US 2008/0048327
Semiconductor Memory Device
Application:
11/873,769 →
Publication:
US 2008/0032463
Semiconductor Bonding and Layer Transfer Method
Leak Indicator Comprising a Sniffer Probe
Semiconductor Layer Structure and Method of Making the Same
Semiconductor Layer Structure and Method of Making the Same
Wafer Bonding Method
Semiconductor Circuit and Method of Fabricating the Same
Bonded Semiconductor Structure and Method of Making the Same
Information Storage System Which Includes a Bonded Semiconductor Structure
Semiconductor Memory Device
Method for Fabricating a Semiconductor Memory Device
Application:
12/635,496 →
Publication:
US 2011/0143506
Electronic Circuit with Embedded Memory
Application:
12/637,559 →
Publication:
US 2010/0133695
Three-Dimensional Semiconductor Structure and Method of Manufacturing the Same
Application:
12/731,087 →
Publication:
US 2010/0190334
Semiconductor Circuit Structure and Method of Forming the Same Using a Capping Layer
Semiconductor Circuit Structure and Method of Making the Same
Semiconductor Circuit
Semiconductor Circuit and Method of Forming the Semiconductor Circuit Using a Capping Layer
Application:
61/346,847 →
Bonded Memory Circuit and Method of Fabrication
Application:
61/349,134 →
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 21, 2007
From: WETZIG, DANIEL; MEBUS, STEFAN
To: INFICON GMBH
Reel/Frame 019783/0321 →
Security Agreement
May 8, 2013
From: BESANG INC.
To: DAEHONG TECHNEW CORPORATION
Reel/Frame 030373/0668 →
Release of Security Interest
Apr 27, 2018
From: DAEHONG TECHNEW CORPORATION
To: BESANG INC.
Reel/Frame 045658/0353 →