Patent Assignment
Reel/Frame 025916/0200
Assignment of Assignor's Interest
Recorded: 2011-03-08
Pages: 4
Assignors
DAS, RABINDRA N.
Executed: 2011-01-26
POLIKS, MARK D.
Executed: 2011-01-26
MARKOVICH, VOYA R.
Executed: 2011-01-26
MOSCHAK, PETER A.
Executed: 2011-01-26
Assignee
ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
1093 CLARK STREET, ENDICOTT, NEW YORK, 13760
Covered Property
(1)
Circuitized Substrate with Internal Thin Film Capacitor and Method of Making Same
Application:
13/042,578 →
Publication:
US 2012/0228014
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
May 6, 2013
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.; EI TRANSPORTATION COMPANY LLC; ENDICOTT MEDTECH, INC.; INTEGRIAN HOLDINGS, LLC
To: M&T BANK
Reel/Frame 030359/0057 →
Security Agreement
Jun 12, 2013
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: MAINES, WILLIAM; MAINES, DAVID
Reel/Frame 030599/0918 →
Release of Security Interest
Feb 26, 2015
From: MAINES, WILLIAM; MAINES, DAVID
To: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
Reel/Frame 035098/0968 →
Assignment of Assignor's Interest
Apr 16, 2015
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: I3 ELECTRONICS, INC.
Reel/Frame 035442/0569 →