Patent Assignment
Reel/Frame 025919/0708
Assignment of Assignor's Interest
Recorded: 2011-03-08
Pages: 7
Assignors
LEE, JONG-CHEOL
Executed: 2011-02-07
PARK, KI-YEON
Executed: 2011-02-07
CHUNG, CHUN-HYUNG
Executed: 2011-02-07
YOO, CHA-YOUNG
Executed: 2011-02-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Devices Including Complex Dielectric Layers and Related Fabrication Methods