Patent Assignment
Reel/Frame 025947/0856
Assignment of Assignor's Interest
Recorded: 2011-03-09
Pages: 5
Assignors
AVSIAN, OSHER
Executed: 2010-06-11
GRINMAN, ANDREY
Executed: 2010-06-11
HUMPSTON, GILES
Executed: 2011-03-07
MARGALIT, MOTI
Executed: 2010-12-12
Assignee
TESSERA TECHNOLOGIES HUNGARY KFT.
C/O TMF HUNGARY LTD., WESSELENYI U. 16, BUDAPEST, 1077, HUNGARY
Covered Property
(1)
Die stack package fabricated at the wafer level with pad extensions applied to reconstituted wafer elements
Application:
60/963,209 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 14, 2011
From: TESSERA TECHNOLOGIES HUNGARY KFT.
To: TESSERA TECHNOLOGIES IRELAND LIMITED
Reel/Frame 026444/0987 →
Assignment of Assignor's Interest
Jun 22, 2011
From: TESSERA TECHNOLOGIES HUNGARY HOLDING LIMITED LIABILITY COMPANY
To: TESSERA TECHNOLOGIES IRELAND LIMITED
Reel/Frame 026499/0740 →