Patent Application
Provisional
App. No. 60/963,209
· Confirmation No. 7362
Die stack package fabricated at the wafer level with pad extensions applied to reconstituted wafer elements
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2007-08-20 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2007-08-03 | TRNA |
Transmittal of New Application | 2 | View | |
| 2007-08-03 | ADS |
Application Data Sheet | 3 | View | |
| 2007-08-03 | SPEC |
Specification | 28 | View | |
| 2007-08-03 | DRW |
Drawings-only black and white line drawings | 17 | View | |
| 2007-08-03 | WFEE |
Fee Worksheet (SB06) | 1 | View |
Inventors
Osher Avsian
Kiryat Ono, ISRAEL
Andrey Grinman
Jerusalem, ISRAEL
Giles Humpston
Buckinghamshire, UNITED KINGDOM
Moti Margalit
Zichron, ISRAEL
Attorneys & Agents of Record
Prosecution
- Customer No.
- 38091
- Docket No.
- TESHEL 3.8-027
- Confirmation No.
- 7362
Child
Claims priority from a provisional application
→
App. 12/671,993
· US 8,551,815
Filed 2010-07-16
· Patented Case
Child
Claims priority from a provisional application
→
App. 14/036,684
Filed 2013-09-25
· Abandoned -- Failure to Respond to an Office Action
Child
PCT
Claims priority from a provisional application
→
PCT/US2008/009353
Filed 2008-08-01
· RO PROCESSING COMPLETED-PLACED IN STORAGE
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2011-06-22
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2011-06-14
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2011-03-09
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Quick Facts
- App. No.
- 60/963,209
- Filed
- 2007-08-03
External Links