Patent Assignment
Reel/Frame 026444/0987
Assignment of Assignor's Interest
Recorded: 2011-06-14
Pages: 2
Assignor
TESSERA TECHNOLOGIES HUNGARY KFT.
Executed: 2011-06-08
Assignee
TESSERA TECHNOLOGIES IRELAND LIMITED
CLIONA BUILDING ONE, PARKMORE EAST BUSINESS PARK BALLYBRIT, GALWAY, 1077, IRELAND
Covered Property
(1)
Die stack package fabricated at the wafer level with pad extensions applied to reconstituted wafer elements
Application:
60/963,209 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 9, 2011
From: AVSIAN, OSHER; GRINMAN, ANDREY; HUMPSTON, GILES; MARGALIT, MOTI
To: TESSERA TECHNOLOGIES HUNGARY KFT.
Reel/Frame 025947/0856 →
Assignment of Assignor's Interest
Jun 22, 2011
From: TESSERA TECHNOLOGIES HUNGARY HOLDING LIMITED LIABILITY COMPANY
To: TESSERA TECHNOLOGIES IRELAND LIMITED
Reel/Frame 026499/0740 →