Patent Assignment
Reel/Frame 025978/0294
Assignment of Assignor's Interest
Recorded: 2011-03-18
Pages: 8
Assignors
LEE, HO-JIN
Executed: 2011-01-13
JEONG, SEYOUNG
Executed: 2011-01-14
PHEE, JAE-HYUN
Executed: 2011-01-13
KIM, JUNG-HWAN
Executed: 2011-01-14
MIN, TAE HONG
Executed: 2011-01-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multi-Layer Tsv Insulation and Methods of Fabricating the Same