Patent Assignment
Reel/Frame 026032/0526
Assignment of Assignor's Interest
Recorded: 2011-03-28
Pages: 8
Assignors
KWON, HEUNG-KYU
Executed: 2011-03-25
LEE, SEOK-WON
Executed: 2011-03-25
KIM, HYON-CHOL
Executed: 2011-03-25
LEE, SU-CHANG
Executed: 2011-03-25
LEE, CHI-YOUNG
Executed: 2011-03-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Having Warpage Compensation