Assignment of Assignor's Interest

Recorded: 2011-04-01 Pages: 2

Assignor

USAMI, TATSUYA

Executed: 2006-02-14

Assignee

NEC ELECTRONICS CORPORATION

1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN

Covered Property (1)

Method for Manufacturing a Semiconductor Device Having an Interconnect Structure and a Reinforcing Insulating Film

Patent: 8,242,014 →

Application: 13/078,605 →

Publication: US 2012/0083115

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.