Patent Assignment
Reel/Frame 026063/0308
Change of Name
Recorded: 2011-04-01
Pages: 5
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Property
(1)
Method for Manufacturing a Semiconductor Device Having an Interconnect Structure and a Reinforcing Insulating Film
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.