IP Library Assignment 026082/0946
Patent Assignment
Reel/Frame 026082/0946

Merger

Recorded: 2011-04-06 Pages: 22
Assignor
ULVAC MATERIALS, INC.
Executed: 2010-10-01
Assignee
ULVAC, INC.
NO. 2500, HAGISONO,, CHIGASAKI-SHI, KANAGAWA-KEN, JAPAN
Covered Properties (2)
Dispersion Containing Cu Ultrafine Particles Individually Dispersed Therein
Patent: 6,214,259 →
Application: 09/369,932 →
Thin Film Aluminum Alloy and Sputtering Target to Form the Same
Patent: 6,791,188 →
Application: 10/228,064 →
Publication: US 2003/0047812
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 5, 1999
From: ODA, MASAAKI; IMAZEKI, NOBUYA; YAMAKAWA, HIROYUKI; MURAKAMI, HIROHIKO
To: VACUUM METALLURGICAL CO., LTD.; NIHON SHINKU GIJUTSU KABUSHIKI KAISHA
Reel/Frame 010285/0949 →
Assignment of Assignor's Interest Aug 27, 2002
From: HAGIHARA, JUNICHIRO; TOKUDA, ICHIRO
To: VACUUM METALLURGICAL CO., LTD. (SHINKUU YAKIN KABUSHIKI KAISHA)
Reel/Frame 013236/0031 →
Change of Name Aug 3, 2005
From: VACUUM METALLURGICAL CO., LTD.
To: ULVAC MATERIALS, INC.
Reel/Frame 016345/0170 →
Change of Name Dec 8, 2010
From: NIHON SHINKU GIJUTSU KABUSHIKI KAISHA
To: ULVAC, INC.
Reel/Frame 025469/0352 →