Patent Assignment
Reel/Frame 026098/0765
Assignment of Assignor's Interest
Recorded: 2011-04-08
Pages: 2
Assignee
HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
6, MENUMA-NISHI 1-CHOME, KUMAGAYA-SHI, SAITAMA, JAPAN
Covered Property
(1)
Die Bonder and Semiconductor Manufacturing Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.