IP Library › Assignment 035870/0158
Patent Assignment
Reel/Frame 035870/0158

Assignment of Assignor's Interest

Recorded: 2015-06-19 Pages: 4
Assignor
Assignee
FASFORD TECHNOLOGY CO., LTD.
610-5 SHIMOIMASUWA, MINAMI-ALPS CITY, YAMANASHI, 400-0212, JAPAN
Covered Properties (21)
Die Bonder, Pickup Method, and Pickup Device
Patent: 8,561,664 →
Application: 12/880,383 →
Publication: US 2011/0308738
Tool Management Method of Die Bonder and Die Bonder
Patent: 8,593,261 →
Application: 13/043,820 →
Publication: US 2012/0075079
Motor Control System and Motor Control Method
Patent: 8,456,126 →
Application: 13/044,000 →
Publication: US 2012/0212171
Die Bonder and Semiconductor Manufacturing Method
Patent: 8,540,001 →
Application: 13/044,148 →
Publication: US 2012/0214258
Pick-Up Method of Die Bonder and Die Bonder
Patent: 9,343,338 →
Application: 13/224,366 →
Publication: US 2012/0244647
Die Bonder
Patent: 9,099,524 →
Application: 13/224,511 →
Publication: US 2013/0016205
Foreign Substance Removing Device and Die Bonder Equipped with the Same
Patent: 8,783,319 →
Application: 13/224,536 →
Publication: US 2012/0241096
Frame Feeding System and Frame Feeding Method
Patent: 8,965,572 →
Application: 13/224,789 →
Publication: US 2013/0017040
Biaxial Drive Mechanism and Die Bonder
Application: 13/226,128 →
Publication: US 2013/0014904
Biaxial Drive Mechanism, Die Bonder and Die Bonder Operating Method
Application: 13/226,138 →
Publication: US 2013/0014881
Die Bonder and Bonding Method
Patent: 8,991,681 →
Application: 13/412,684 →
Publication: US 2013/0068823
Die Bonder and Bonding Method
Patent: 8,460,491 →
Application: 13/414,236 →
Die Bonder and Bonding Method
Application: 13/415,920 →
Publication: US 2013/0068826
Die Bonder and Bonding Method
Application: 13/585,900 →
Publication: US 2013/0068824
Die Bonder and Bonding Method
Patent: 8,727,202 →
Application: 13/585,905 →
Publication: US 2013/0071956
Two-Shaft Drive Mechanism and Die Bonder
Patent: 9,324,679 →
Application: 13/587,101 →
Publication: US 2013/0221764
Die Bonding Apparatus, Die Picking Up Apparatus And Die Picking Up Method
Patent: 9,245,778 →
Application: 13/779,934 →
Publication: US 2014/0060751
Die Bonder and Method of Position Recognition of Die
Application: 13/780,065 →
Publication: US 2014/0078289
Horizontal Axis Drive Mechanism, Two-Axis Drive Mechanism, and Die Bonder
Application: 13/784,241 →
Publication: US 2014/0074280
Die Bonder And Bonding Method
Patent: 9,362,250 →
Application: 13/784,253 →
Publication: US 2014/0069564
Collet Cleaning Method and Die Bonder Using the Same
Patent: 9,318,361 →
Application: 14/104,705 →
Publication: US 2014/0251535
Related Assignments (19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 23, 2010
From: MAKI, HIROSHI; OKAMOTO, NAOKI
To: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
Reel/Frame 025395/0486 →
Assignment of Assignor's Interest Apr 8, 2011
From: KIHARA, MASAMICHI; KISHI, YOSHIAKI
To: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
Reel/Frame 026098/0765 →
Assignment of Assignor's Interest Apr 19, 2011
From: TATE, MITSUAKI; ISHII, YASUSHI; KIHARA, MASAMICHI
To: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
Reel/Frame 026151/0849 →
Assignment of Assignor's Interest Apr 20, 2011
From: TAKAGI, SUSUMU; MAKI, HIROSHI
To: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
Reel/Frame 026157/0810 →
Assignment of Assignor's Interest Sep 29, 2011
From: MAKITA, YOSHIAKI; FUKASAWA, SHINGO
To: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
Reel/Frame 026992/0242 →
Assignment of Assignor's Interest Sep 29, 2011
From: HOSAKA, KOJI; FUKASAWA, SHINGO
To: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
Reel/Frame 026992/0863 →
Assignment of Assignor's Interest Oct 3, 2011
From: FUKASAWA, SHINGO; HOSAKA, KOJI
To: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
Reel/Frame 027003/0783 →
Assignment of Assignor's Interest Oct 19, 2011
From: YAMAGAMI, TAKASHI; TAKANO, RYUICHI; MAKI, HIROSHI; MOCHIZUKI, MASAYUKI
To: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
Reel/Frame 027083/0827 →
Assignment of Assignor's Interest Oct 19, 2011
From: OKAMOTO, NAOKI; YAMAMOTO, KEITA
To: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
Reel/Frame 027083/0704 →
Assignment of Assignor's Interest Oct 31, 2011
From: OHKUBO, TATSUYUKI; YODA, MITSUO
To: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
Reel/Frame 027148/0781 →
Assignment of Assignor's Interest Apr 13, 2012
From: MAKI, HIROSHI; MOCHIZUKI, MASAYUKI; TANI, YUKIO; MOCHIZUKI, TAKEHITO
To: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
Reel/Frame 028045/0227 →
Assignment of Assignor's Interest May 17, 2012
From: MAKI, HIROSHI; MOCHIZUKI, MASAYUKI; TANI, YUKIO; MOCHIZUKI, TAKEHITO
To: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
Reel/Frame 028228/0841 →
Assignment of Assignor's Interest May 24, 2012
From: FUKASAWA, SHINGO; OKUBO, TATSUYUKI; KURIHARA, YOSHIHIRO
To: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
Reel/Frame 028261/0800 →
Assignment of Assignor's Interest Oct 18, 2012
From: MOCHIZUKI, MASAYUKI; MAKI, HIROSHI; TANI, YUKIO; MOCHIZUKI, TAKEHITO
To: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
Reel/Frame 029154/0064 →
Assignment of Assignor's Interest Nov 6, 2012
From: ISHII, YOSHIHIDE; MOCHIZUKI, MASAYUKI; KURIHARA, YOSHIHIRO
To: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
Reel/Frame 029249/0269 →
Assignment of Assignor's Interest Nov 6, 2012
From: NAKAJIMA, NOBUHISA; TANAKA, FUKASHI; MAKI, HIROSHI
To: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
Reel/Frame 029249/0046 →
Assignment of Assignor's Interest Feb 28, 2013
From: OMORI, RYO; KOBASHI, HIDEHARU
To: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
Reel/Frame 029896/0960 →
Assignment of Assignor's Interest May 7, 2013
From: YAMAMOTO, KEITA; OKAMOTO, NAOKI
To: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
Reel/Frame 030362/0539 →
Assignment of Assignor's Interest Jul 11, 2013
From: ISHII, YOSHIHIDE; MOCHIZUKI, MASAYUKI
To: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
Reel/Frame 030775/0878 →