Biaxial Drive Mechanism, Die Bonder and Die Bonder Operating Method
A highly reliable biaxial drive mechanism and a die bonder operating method capable of preventing fall of an elevation axis of a linear motor upon loss of power are disclosed. The biaxial drive mechanism includes a handling part; a biaxial drive axes provided with a first linear motor unit having a first movable part that moves up and down the handling part along a first linear guide and a first stationary part, and a second linear motor unit having a second movable part that moves the handling part in a horizontal direction vertical to a direction of up and down movement and a second stationary part; a main power source that supplies a power source to the biaxial drive axes; and an elevation axis fall prevention unit that prevents fall of a handling part upon loss of power at the main power source.
1 . A biaxial drive mechanism comprising:
a handling part;
a biaxial drive axes provided with a first linear motor unit having a first movable part that moves up/down the handling part along a first linear guide and a first stationary part, and a second linear motor unit having a second movable part that moves the handling part in a horizontal direction vertical to a direction of up and down movement and a second stationary part;
a main power source that supplies a power source to the biaxial drive axes; and
an elevation axis fall prevention unit that prevents fall of a movable part of a handling part upon loss of power at the main power source.
2 . The biaxial drive mechanism according to claim 1 , wherein the biaxial drive axes has:
a connecting part that connects the first movable part via the first linear guide and connects the second movable part directly or indirectly;
a second linear guide that moves the first movable part, the second movable part and the connecting part integrally in the horizontal direction; and
a support body that fixes the first stationary part and the second stationary part with a predetermined length in parallel to each other in the horizontal direction.
3 . The biaxial drive mechanism according to claim 1 , wherein the biaxial drive axes has a third linear guide that fixes the first linear motor unit to the second movable part, and guides movement of the first linear motor unit in the horizontal direction.
4 . The biaxial drive mechanism according to claim 2 , wherein the elevation axis fall prevention unit has:
a stopper provided on a first movable body to move along with the first movable part; and
a support drive part that supports the stopper in a predetermined position upon loss of power.
5 . The biaxial drive mechanism according to claim 3 , wherein the elevation axis fall prevention unit has:
a stopper provided on a first movable body to move along with the first movable part; and
a support drive part that supports the stopper in a predetermined position upon loss of power.
6 . The biaxial drive mechanism according to claim 4 , wherein the support drive part is provided on the first stationary part, otherwise, the support drive part is provided on both end sides of the second stationary part or other stationary part around the second stationary part.
7 . The biaxial drive mechanism according to claim 5 , wherein the support drive part is provided on the first stationary part, otherwise, the support drive part is provided on both end sides of the second stationary part or other stationary part around the second stationary part.
8 . The biaxial drive mechanism according to claim 5 , wherein the support drive part is a solenoid having a bar or an air cylinder having a cylinder rod to protrude in accordance with presence/absence of power source.
9 . The biaxial drive mechanism according to claim 6 , wherein the support drive part is a solenoid having a bar or an air cylinder having a cylinder rod to protrude in accordance with presence/absence of power source.
10 . The biaxial drive mechanism according to claim 4 , wherein the support drive part is provided on the first stationary part,
and wherein the support drive part has an elastic body provided so as to surround a projection on the handling part or provided on the handling part, and a contracting means to contract the elastic body.
11 . The biaxial drive mechanism according to claim 8 , wherein a supporting operation to support in the predetermined position is performed with another power source provided in addition to the main power source.
12 . The biaxial drive mechanism according to claim 9 , wherein a supporting operation to support in the predetermined position is performed with another power source provided in addition to the main power source.
13 . The biaxial drive mechanism according to claim 6 , wherein the support drive part has:
a solenoid having a bar to be able to protrude upon loss of power;
a spring; and
an actuation unit that connects the bar and the spring, see-saw rotates about a supporting point, and protrudes the bar with the spring upon loss of power.
14 . The biaxial drive mechanism according to claim 7 , wherein the support drive part has:
a solenoid having a bar to be able to protrude upon loss of power;
a spring; and
an actuation unit that connects the bar and the spring, see-saw rotates about a supporting point, and protrudes the bar with the spring upon loss of power.
15 . The biaxial drive mechanism according to claim 6 , wherein the support drive part has:
a solenoid having a bar to be able to protrude with another power source provided in addition to the main power source;
an electromagnet; and
an actuation unit attracted to the electromagnet by supply of the main power source and connected to the bar.
16 . The biaxial drive mechanism according to claim 7 , wherein the support drive part has:
a solenoid having a bar to be able to protrude with another power source provided in addition to the main power source;
an electromagnet; and
an actuation unit attracted to the electromagnet by supply of the main power source and connected to the bar.
17 . The biaxial drive mechanism according to claim 2 , further comprising a controller that moves up the first movable part or maintains the first movable part in its current status with another power source provided in addition to the main power source upon loss of power.
18 . The biaxial drive mechanism according to claim 3 , further comprising a controller that moves up the first movable part or maintains the first movable part in its current status with another power source provided in addition to the main power source upon loss of power.
19 . A die bonder having the biaxial drive mechanism in claim 1 , wherein the handling part performs processing on a substrate,
and wherein the handling part is a bonding head that picks up a die from a wafer and bonds the die to the substrate, or a needle that applies a die adhesive to the substrate.
20 . A die bonder having the biaxial drive mechanism in claim 2 , wherein the handling part performs processing on a substrate,
and wherein the handling part is a bonding head that picks up a die from a wafer and bonds the die to the substrate, or a needle that applies a die adhesive to the substrate.
21 . A die bonder having the biaxial drive mechanism in claim 3 , wherein the handling part performs processing on a substrate,
and wherein the handling part is a bonding head that picks up a die from a wafer and bonds the die to the substrate, or a needle that applies a die adhesive to the substrate.
22 . A die bonder having the biaxial drive mechanism in claim 4 , wherein the handling part performs processing on a substrate,
and wherein the handling part is a bonding head that picks up a die from a wafer and bonds the die to the substrate, or a needle that applies a die adhesive to the substrate.
23 . A die bonder having the biaxial drive mechanism in claim 5 , wherein the handling part performs processing on a substrate,
and wherein the handling part is a bonding head that picks up a die from a wafer and bonds the die to the substrate, or a needle that applies a die adhesive to the substrate.
24 . A die bonder having the biaxial drive mechanism in claim 6 , wherein the handling part performs processing on a substrate,
and wherein the handling part is a bonding head that picks up a die from a wafer and bonds the die to the substrate, or a needle that applies a die adhesive to the substrate.
25 . A die bonder having the biaxial drive mechanism in claim 7 , wherein the handling part performs processing on a substrate,
and wherein the handling part is a bonding head that picks up a die from a wafer and bonds the die to the substrate, or a needle that applies a die adhesive to the substrate.
26 . A die bonder having the biaxial drive mechanism in claim 8 , wherein the handling part performs processing on a substrate,
and wherein the handling part is a bonding head that picks up a die from a wafer and bonds the die to the substrate, or a needle that applies a die adhesive to the substrate.
27 . A die bonder having the biaxial drive mechanism in claim 9 , wherein the handling part performs processing on a substrate,
and wherein the handling part is a bonding head that picks up a die from a wafer and bonds the die to the substrate, or a needle that applies a die adhesive to the substrate.
28 . A die bonder having the biaxial drive mechanism in claim 11 , wherein the handling part performs processing on a substrate,
and wherein the handling part is a bonding head that picks up a die from a wafer and bonds the die to the substrate, or a needle that applies a die adhesive to the substrate.
29 . A die bonder having the biaxial drive mechanism in claim 13 , wherein the handling part performs processing on a substrate,
and wherein the handling part is a bonding head that picks up a die from a wafer and bonds the die to the substrate, or a needle that applies a die adhesive to the substrate.
30 . A die bonder having the biaxial drive mechanism in claim 15 , wherein the handling part performs processing on a substrate,
and wherein the handling part is a bonding head that picks up a die from a wafer and bonds the die to the substrate, or a needle that applies a die adhesive to the substrate.
31 . A die bonder having the biaxial drive mechanism in claim 16 , wherein the handling part performs processing on a substrate,
and wherein the handling part is a bonding head that picks up a die from a wafer and bonds the die to the substrate, or a needle that applies a die adhesive to the substrate.
32 . A die bonder having the biaxial drive mechanism in claim 18 , wherein the handling part performs processing on a substrate,
and wherein the handling part is a bonding head that picks up a die from a wafer and bonds the die to the substrate, or a needle that applies a die adhesive to the substrate.
33 . A die bonder operating method comprising:
a step of providing a main power source;
a step of moving up a bonding head with a linear motor by supply of a main power source to pick up a die and bond the die to a substrate; and
a fall prevention step of upon loss of power at the main power source, preventing fall of the bonding head.