Patent Assignment
Reel/Frame 028228/0841
Assignment of Assignor's Interest
Recorded: 2012-05-17
Pages: 2
Assignors
MAKI, HIROSHI
Executed: 2012-03-23
MOCHIZUKI, MASAYUKI
Executed: 2012-03-24
TANI, YUKIO
Executed: 2012-03-25
MOCHIZUKI, TAKEHITO
Executed: 2012-03-25
Assignee
HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
6, MENUMA-NISHI 1-CHOME, KUMAGAYA-SHI, SAITAMA, JAPAN
Covered Property
(1)
Die Bonder and Bonding Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.