Patent Assignment
Reel/Frame 030362/0539
Assignment of Assignor's Interest
Recorded: 2013-05-07
Pages: 2
Assignee
HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
6, MENUMA-NISHI 1-CHOME, KUMAGAYA-SHI, SAITAMA, 360-0238, JAPAN
Covered Property
(1)
Die Bonding Apparatus, Die Picking Up Apparatus And Die Picking Up Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.