Patent Assignment
Reel/Frame 028045/0227
Assignment of Assignor's Interest
Recorded: 2012-04-13
Pages: 2
Assignors
MAKI, HIROSHI
Executed: 2012-03-23
MOCHIZUKI, MASAYUKI
Executed: 2012-03-24
TANI, YUKIO
Executed: 2012-03-25
MOCHIZUKI, TAKEHITO
Executed: 2012-03-25
Assignee
HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
6, MENUMA-NISHI 1-CHOME, KUMAGAYA-SHI, SAITAMA, JAPAN
Covered Property
(1)
Die Bonder and Bonding Method
Application:
13/415,920 →
Publication:
US 2013/0068826
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.