IP Library › Assignment 026157/0810
Patent Assignment
Reel/Frame 026157/0810

Assignment of Assignor's Interest

Recorded: 2011-04-20 Pages: 2
Assignors
TAKAGI, SUSUMU
Executed: 2011-03-10
MAKI, HIROSHI
Executed: 2011-03-10
Assignee
HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
6, MENUMA-NISHI 1-CHOME, KUMAGAYA-SHI, SAITAMA, JAPAN
Covered Property (1)
Tool Management Method of Die Bonder and Die Bonder
Patent: 8,593,261 →
Application: 13/043,820 →
Publication: US 2012/0075079
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 19, 2015
From: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
To: FASFORD TECHNOLOGY CO., LTD.
Reel/Frame 035870/0158 →