Two-shaft drive mechanism and die bonder
A two-shaft drive mechanism includes a processing unit, a first linear motor provided with a first movable portion and a first fixed portion, which elevates the processing unit along a first linear guide, and a second linear motor provided with a second movable portion and a second fixed portion, which moves the processing unit in a horizontal direction vertical to the direction for elevating the processing unit, a support body that fixes the first fixed portion, a second linear guide that is provided between the support body and the second fixed portion, and allows the second fixed portion to freely move, and a control unit that controls a position of the first movable portion in the horizontal direction based on an output of the linear sensor that detects a position of the first movable portion in a horizontal direction with respect to the support body.
1. A two-shaft drive mechanism comprising:
a processing unit;
a first linear motor provided with a first movable portion and a first fixed portion, which elevates the processing unit along a first linear guide, and a second linear motor provided with a second movable portion and a second fixed portion, which moves the processing unit in a horizontal direction vertical to the direction for elevating the processing unit;
a support body that fixes the first fixed portion;
a second linear guide that is provided between the support body and the second fixed portion, and allows the second fixed portion to freely move as a counter weight in the Y direction;
a linear sensor that detects a position of the first movable portion in a horizontal direction with respect to the support body; and
a control unit that controls a position of the first movable portion in the horizontal direction based on an output of the linear sensor;
wherein the second fixed portion moves inertially in directions opposite to directions of the support body.
2. The two-shaft drive mechanism according to claim 1 , further comprising a connection portion that connects the first movable portion and the second movable portion directly or indirectly via the first linear guide, and a third linear guide that moves the first movable portion, the second movable portion and the connection portion integrally in the horizontal direction.
3. The two-shaft drive mechanism according to claim 2 , wherein the first movable portion is provided in a direction vertical to the second movable portion, and the second linear guide and the third linear guide are provided parallel to each other.
4. The two-shaft drive mechanism according to claim 3 , wherein the second linear guide is identical to the third linear guide.
5. The two-shaft drive mechanism according to claim 2 , wherein the first movable portion is provided parallel to the second movable portion, and the first fixed portion is provided parallel to the second fixed portion.
6. The two-shaft drive mechanism according to claim 5 , wherein a fourth linear guide is provided between the support body that fixes the second linear guide and the connection portion.
7. The two-shaft drive mechanism according to claim 2 , wherein a magnet formed by arranging a plurality of pairs of N-poles and S-poles alternately on the first movable portion in the elevating direction is provided on a predetermined region in the horizontal direction.
8. A die bonder having a two-shaft drive mechanism, the two-shaft drive mechanism comprising:
a processing unit processes with respect to a substrate;
a first linear motor provided with a first movable portion and a first fixed portion, which elevates the processing unit along a first linear guide, and a second linear motor provided with a second movable portion and a second fixed portion, which moves the processing unit in a horizontal direction vertical to the direction for elevating the processing unit;
a support body that fixes the first fixed portion;
a second linear guide that is provided between the support body and the second fixed portion, and allows the second fixed portion to freely move as a counter weight in the Y direction;
a linear sensor that detects a position of the first movable portion in a horizontal direction with respect to the support body; and
a control unit that controls a position of the first movable portion in the horizontal direction based on an output of the linear sensor;
wherein the second fixed portion moves inertially in directions opposite to directions of the support body.
9. The die bonder comprising according to claim 8 ,
wherein the two-shaft drive further comprising a connection portion that connects the first movable portion and the second movable portion directly or indirectly via the first linear guide, and a third linear guide that moves the first movable portion, the second movable portion and the connection portion integrally in the horizontal direction.
10. The die bonder comprising according to claim 9 , wherein the first movable portion is provided in a direction vertical to the second movable portion, and the second linear guide and the third linear guide are provided parallel to each other.
11. The die bonder comprising according to claim 10 , wherein the second linear guide is identical to the third linear guide.
12. The die bonder comprising according to claim 9 , wherein the first movable portion is provided parallel to the second movable portion, and the first fixed portion is provided parallel to the second fixed portion.
13. The die bonder comprising according to claim 12 , wherein a fourth linear guide is provided between the support body that fixes the second linear guide and the connection portion.
14. The die bonder comprising according to claim 9 , wherein a magnet formed by arranging a plurality of pairs of N-poles and S-poles alternately on the first movable portion in the elevating direction is provided on a predetermined region in the horizontal direction.
15. The die bonder according to claim 14 , wherein the processing unit is a bonding head that picks up a die from a wafer, and bonds the die to the substrate.
16. The die bonder according to claim 15 , wherein the predetermined region includes a pickup region and a bonding region.
17. The die bonder according to claim 8 , wherein the processing unit is a needle used for applying a die adhesive agent to the substrate.