Pick-up method of die bonder and die bonder
When a die to be stripped out of plural dies (semiconductor chips) bonded to a dicing film is to be tossed and stripped from the dicing film, the dicing film corresponding to predetermined positions out of the peripheral portion of the die is tossed to form stripping start points. The dicing film corresponding to portions other than the above predetermined positions is then tossed to strip the die from the dicing film.
1. A pick-up method of a die bonder, comprising:
determining a tossing amount of a die to be stripped out of a plurality of dies bonded to a dicing film with reference to a mapping table having tossing amount information recorded based on a measured tension of the dicing film and corresponding information on a position of the die and number of dies existing around the die on the dicing film;
adsorbing the die by way of a collet and the dicing film by a dome head; and
tossing the dicing film to which the die is bonded by the tossing amount determined in order to strip the die from the dicing film.
2. The pick-up method of a die bonder according to claim 1 , comprising measuring a tension of the dicing film in advance, and recording the tossing amount in the mapping table based on the tension measured.
3. The pick-up method of a die bonder according to claim 2 , wherein the mapping table further includes information on whether the die is of adequate quality or defective.
4. The pick-up method of a die bonder according to claim 1 , wherein the mapping table further includes information on whether the die is of adequate quality or defective.
5. The pick-up method of a die bonder according to claim 1 , further comprising lifting stripping start point forming pins at certain positions.
6. The pick-up method of a die bonder according to claim 1 , wherein adsorbing the die by way of the collet occurs after adsorbing the dicing film by the dome head.
7. A pick-up method of a die bonder, comprising:
determining a tossing amount of a die to be stripped out of a plurality of dies bonded to a dicing film with reference to a mapping table having tossing amount information recorded based on a measured tension of the dicing film and corresponding information on a position of the die and number of dies existing around the die on the dicing film;
adsorbing the die by way of a collet and the dicing film by a dome head;
tossing the dicing film to which the die is bonded by the tossing amount determined in order to strip the die from the dicing film; and
measuring tension of the dicing film after the die stripped, and recording the tossing amount in the mapping table based on the tension of the dicing film measured.