IP Library › Assignment 027083/0704
Patent Assignment
Reel/Frame 027083/0704

Assignment of Assignor's Interest

Recorded: 2011-10-19 Pages: 2
Assignors
OKAMOTO, NAOKI
Executed: 2011-08-31
YAMAMOTO, KEITA
Executed: 2011-08-31
Assignee
HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
6, MENUMA-NISHI 1-CHOME, KUMAGAYA-SHI, SAITAMA, JAPAN
Covered Property (1)
Pick-Up Method of Die Bonder and Die Bonder
Patent: 9,343,338 →
Application: 13/224,366 →
Publication: US 2012/0244647
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 19, 2015
From: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
To: FASFORD TECHNOLOGY CO., LTD.
Reel/Frame 035870/0158 →