Patent Assignment
Reel/Frame 028261/0800
Assignment of Assignor's Interest
Recorded: 2012-05-24
Pages: 2
Assignors
FUKASAWA, SHINGO
Executed: 2012-03-21
OKUBO, TATSUYUKI
Executed: 2012-03-21
KURIHARA, YOSHIHIRO
Executed: 2012-03-21
Assignee
HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
6, MENUMA-NISHI 1-CHOME, KUMAGAYA-SHI, SAITAMA, JAPAN
Covered Property
(1)
Die Bonder and Bonding Method
Patent:
8,460,491 →
Application:
13/414,236 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.