Die bonder and bonding method
The present invention provides die bonder and bonding method by which a bonding load from a high load to a low load is obtained or high-speed mounting is attained. In a die bonder or a bonding method in which a bonding head is ascended/descended by a first ascending/descending drive shaft unit, a die is picked up, the picked-up die is installed onto a workpiece, and after installed, a load is exerted on the die by the bonding head to bond the die to the workpiece, whether the load is higher/lower than a predetermined load is determined, and in bonding, when the load is higher than the predetermined load, the high load is exerted by the first ascending/descending drive shaft unit, and when the load is lower than the predetermined load, the low load is exerted by a second ascending/descending drive shaft unit.
1. A die bonder, comprising:
a die bonding head for picking up a die and bonding the die onto a workpiece;
a biaxial drive shaft unit which includes an ascending/descending drive shaft unit for ascending/descending the bonding head and a horizontal-direction drive shaft unit for moving the ascending/descending drive shaft unit in a horizontal direction perpendicular to a direction in which the bonding head is ascended/descended; and
a control unit for controlling the biaxial drive shaft unit
wherein, the ascending/descending drive shaft unit includes
a first ascending/descending drive shaft unit for ascending/descending the bonding head and being able to exert a high bonding load which is higher than a predetermined load on the die via the bonding head, and
a second ascending/descending drive shaft unit which is installed on the side of a leading end of the first ascending/descending drive shaft unit, ascends/descends in the direction in which the bonding head is ascended/descended and is able to exert a low bonding load which is lower than the predetermined load on the die via the bonding head.
2. The die bonder according to claim 1 , wherein
the first ascending/descending drive shaft unit and the second ascending/descending drive shaft unit are configured using linear motors.
3. The die bonder according to claim 2 , wherein
the linear motor of the first ascending/descending drive shaft unit is a magnet type linear motor, and the linear motor of the second ascending/descending drive shaft unit is a voice coil motor.
4. The die bonder according to claim 2 , wherein
the control unit torque-controls the linear motor of the first ascending/descending drive shaft unit when the bonding load is to be exerted and position-controls the linear motor of the first ascending/descending drive shaft unit in other cases.
5. The die bonder according to claim 1 , wherein
a load detection sensor for detecting the high bonding load is disposed on the first ascending/descending drive shaft unit with which a head of the bonding head is brought into contact.
6. The die bonder according to claim 1 , wherein
the first ascending/descending drive shaft unit includes a first linear motor which includes a first movable part used for ascending/descending the bonding head along a first linear guide and a first stationary part as a drive shaft unit,
the horizontal direction drive shaft unit includes a second linear motor which includes a second movable part used for moving the bonding head in the horizontal direction and a second stationary part as a drive shaft unit, and includes
a coupling part for coupling the first movable part via the first linear guide and directly or indirectly coupling the second movable part,
a second linear guide for integrally moving the first movable part, the second movable part and the coupling part in the horizontal direction, and
a support for fixing the first fixing part and the second fixing part in the horizontal direction in parallel with each other along a predetermined length.
7. The die bonder according to claim 2 , further comprising:
a main power supply for supplying power to the biaxial drive shaft unit; and
an ascending/descending shaft unit a fall-preventing unit for preventing the bonding head from falling when the power from the main power supply has been lost.
8. A bonding method, comprising:
the picking-up step of ascending/descending a bonding head by a first ascending/descending drive shaft unit and picking up a die;
the installing step of descending the bonding head to install the picked-up die on a workpiece; and
the bonding step of bonding the die to the workpiece by exerting a load on the die by the bonding head after installed, and further comprising:
the determining step of determining whether the load is higher/lower than a predetermined load,
wherein the bonding step includes the high load exerting step of, when the load is a high load which is higher than the predetermined load, exerting the high load by the first ascending/descending drive shaft unit, and the low load exerting step of, when the load is a low load which is lower than the predetermined load, exerting the low load by a second ascending/descending drive shaft unit which is serially installed under the first ascending/descending drive shaft unit.
9. The bonding method according to claim 8 , wherein
the picking-up step controls loads to be exerted when picking up the die and when bonding the die by the second ascending/descending drive shaft unit.
10. The bonding method according to claim 8 , wherein
the high load exerting step reduces the load on the second ascending/descending drive shaft unit to zero or to almost zero to switch control of the first ascending/descending drive shaft unit from position control to torque control.
11. The bonding method according to claim 8 , wherein
the low load exerting step position-controls the first ascending/descending drive shaft unit while the load is being exerted.