IP Library › Assignment 029249/0046
Patent Assignment
Reel/Frame 029249/0046

Assignment of Assignor's Interest

Recorded: 2012-11-06 Pages: 2
Assignors
NAKAJIMA, NOBUHISA
Executed: 2012-07-25
TANAKA, FUKASHI
Executed: 2012-07-25
MAKI, HIROSHI
Executed: 2012-07-25
Assignee
HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
6, MENUMA-NISHI 1-CHOME, KUMAGAYA-SHI, SAITAMA, JAPAN
Covered Property (1)
Die Bonder and Bonding Method
Patent: 8,727,202 →
Application: 13/585,905 →
Publication: US 2013/0071956
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 19, 2015
From: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
To: FASFORD TECHNOLOGY CO., LTD.
Reel/Frame 035870/0158 →