Die bonder and bonding method
With a die bonder or a bonding method, the die is adsorbed by the collet, the dicing tape to which the die is adsorbed is thrust up, the die adsorbed by the collet, and thrust up is peeled from the dicing tape, and the peeled die is bonded to the substrate. When the decrease in the air leak flow rate through the gap between the collet and the die upon the thrust up is smaller than the decrease in the normal peel by a predetermined amount, it is judged that a deflection occurs in the die.
1. A bonding method comprising:
an adsorbing step of adsorbing a die using a collet;
a thrust-up step of thrusting up a dicing tape to which the die is adsorbed;
a peeling step of peeling the die, which is adsorbed by the collet and is thrust up, from the dicing tape;
a bonding step of bonding the peeled die to the substrate; and
a first judgment step of judging that a deflection occurs in the die when a decrease rate in an air leak flow rate through a gap between the collet and the die upon the thrust up is smaller than the decrease rate in a normal peel by a predetermined amount after the air leak flow rate is reversed from increase to decrease.
2. The bonding method according to claim 1 , wherein the first judgment step judges the decrease rate in the air leak flow rate based on a differential value.
3. The bonding method according to claim 1 , further comprising a second judgment step, which judges that a crack occurs in the die when the air leak flow rate becomes constant or substantially constant.
4. The bonding method according to claim 1 , wherein the first judgment step judges that the peel is normally done in spite of a deflection when the air leak flow rate becomes equal to or smaller than a first predetermined value, or the decrease in the air leak flow rate is equal to or smaller than a second predetermined value within a predetermined time.
5. The bonding method according to claim 1 , wherein:
a peel start point is formed by thrusting up the dicing tape at a predetermined portion of a peripheral portion of the die; and
the first judgment step is executed when forming the peel start point.
6. The bonding method according to claim 3 , wherein:
a peel start point is formed by thrusting up the dicing tape at a predetermined portion of a peripheral portion of the die; and
the first judgment step is executed when forming the peel start point.
7. The bonding method according to claim 3 , wherein the peel start point is formed at the predetermined portion provided at least at one corner portion of four corner portions of the die.