IP Library › Assignment 029154/0064
Patent Assignment
Reel/Frame 029154/0064

Assignment of Assignor's Interest

Recorded: 2012-10-18 Pages: 2
Assignors
MOCHIZUKI, MASAYUKI
Executed: 2012-07-25
MAKI, HIROSHI
Executed: 2012-07-25
TANI, YUKIO
Executed: 2012-07-25
MOCHIZUKI, TAKEHITO
Executed: 2012-07-25
Assignee
HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
6, MENUMA-NISHI 1-CHOME, KUMAGAYA-SHI, SAITAMA, JAPAN
Covered Property (1)
Die Bonder and Bonding Method
Application: 13/585,900 →
Publication: US 2013/0068824
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 19, 2015
From: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
To: FASFORD TECHNOLOGY CO., LTD.
Reel/Frame 035870/0158 →