Biaxial Drive Mechanism and Die Bonder
A biaxial drive mechanism including a Z axis capable of realizing a high speed elevation axis without an increment in torque on a horizontal drive axes and a die bonder using the biaxial drive mechanism is disclosed. The biaxial drive mechanism includes a handling part; a first linear motor having a first movable part that moves up/down the handling part and a first stationary part; a second linear motor having a second movable part and a second stationary part; a connecting part that directly or indirectly connects the first movable part to the second movable part via the first linear guide; a second linear guide that moves the first movable part; and a support body that fixes the first stationary part and the second stationary part with a predetermined length in parallel to each other in the horizontal direction.
1 . A biaxial drive mechanism comprising:
a handling part;
a first linear motor having a first movable part that moves up and down the handling part along a first linear guide and a first stationary part;
a second linear motor having a second movable part that moves the handling part in a horizontal direction vertical to a direction of up and down movement and a second stationary part;
a connecting part that connects the first movable part via the first linear guide and connects the second movable part directly or indirectly;
a second linear guide that moves the first movable part, the second movable part and the connecting part integrally in the horizontal direction; and
a support body that fixes the first stationary part and the second stationary part with a predetermined length in parallel to each other in the horizontal direction.
2 . The biaxial drive mechanism according to claim 1 , wherein the first movable part and the second movable part are provided in parallel or vertical to each other.
3 . The biaxial drive mechanism according to claim 1 , wherein the second linear guide is provided on the support body provided in a lower part of the second stationary part.
4 . The biaxial drive mechanism according to claim 1 , wherein the second liner guide is provided on the support body in an upper part of the connecting part.
5 . The biaxial drive mechanism according to claim 1 , wherein a plurality of pairs of alternate N pole and S pole electromagnets, provided in the direction of up and down movement in the first movable part, are provided in a predetermined region in the horizontal direction.
6 . The biaxial drive mechanism according to claim 1 , wherein a third linear guide is provided between the first stationary part or the second stationary part and the connecting part.
7 . A die bonder having the biaxial drive mechanism in claim 1 , wherein the handling part performs processing on a substrate.
8 . A die bonder having the biaxial drive mechanism in claim 2 , wherein the handling part performs processing on a substrate.
9 . A die bonder having the biaxial drive mechanism in claim 3 , wherein the handling part performs processing on a substrate.
10 . A die bonder having the biaxial drive mechanism in claim 4 , wherein the handling part performs processing on a substrate.
11 . A die bonder having the biaxial drive mechanism in claim 5 , wherein the handling part performs processing on a substrate.
12 . A die bonder having the biaxial drive mechanism in claim 6 , wherein the handling part performs processing on a substrate.
13 . The die bonder according to claim 7 , wherein the handling part is a bonding head that picks up a die from a wafer and bonds the die to the substrate, or a needle that applies a die adhesive to the substrate.
14 . The die bonder according to claim 8 , wherein the handling part is a bonding head that picks up a die from a wafer and bonds the die to the substrate, or a needle that applies a die adhesive to the substrate.
15 . The die bonder according to claim 9 , wherein the handling part is a bonding head that picks up a die from a wafer and bonds the die to the substrate, or a needle that applies a die adhesive to the substrate.
16 . The die bonder according to claim 10 , wherein the handling part is a bonding head that picks up a die from a wafer and bonds the die to the substrate, or a needle that applies a die adhesive to the substrate.
17 . The die bonder according to claim 11 , wherein the handling part is a bonding head that picks up a die from a wafer and bonds the die to the substrate, or a needle that applies a die adhesive to the substrate.
18 . The die bonder according to claim 12 , wherein the handling part is a bonding head that picks up a die from a wafer and bonds the die to the substrate, or a needle that applies a die adhesive to the substrate.
19 . A die bonder having the biaxial drive mechanism in claim 5 , wherein the handling part is a bonding head that picks up a die from a wafer and bonds the die to the substrate,
and wherein the predetermined region is a region for pickup and a region for bonding.
20 . The die bonder according to claim 7 , wherein a rotation unit that rotates the handling part about the direction of up and down movement as a rotation axis is provided in the first movable part.