Patent Assignment
Reel/Frame 029896/0960
Assignment of Assignor's Interest
Recorded: 2013-02-28
Pages: 2
Assignee
HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
6, MENUMA-NISHI 1-CHOME, KUMAGAYA-SHI, SAITAMA, 360-0238, JAPAN
Covered Property
(1)
Die Bonder and Method of Position Recognition of Die
Application:
13/780,065 →
Publication:
US 2014/0078289
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.