Foreign substance removing device and die bonder equipped with the same
The invention has an object to provide a foreign substance removing device that is capable of quickly and efficiently cleaning substrate surfaces regardless of the size thereof and preventing readhesion of once removed foreign substances as well as to provide a die bonder equipped with the same. The foreign substance removing device of the invention includes: a pickup device to which a dicing film carrying dies thereon is fixed; and a collet for picking up a die separated from the dicing film and placing the die on a substrate having an adhesive applied thereon, and operates to remove foreign substances on the substrate in preparation for application of the adhesive onto the substrate. The foreign substance removing device includes a cleaning nozzle integrating an air outlet orifice and an air inlet orifice.
1. A die bonder comprising:
conveying means for conveying a substrate along a transport path;
a coating unit for applying an adhesive to the substrate while the substrate is conveyed along the transport path;
a bonding means for bonding a substrate die picked from the wafer to a part coated with the adhesive; and
a foreign substance removing device for removing foreign matter on the substrate provided upstream of the coating unit;
wherein the foreign substance removing device comprises a cleaning nozzle integrating an air outlet orifice and an air inlet orifice, and a moving means for moving the cleaning nozzle at a distance from the substrate according to the size of the substrate in a direction perpendicular to a direction in which the substrate is conveyed; and
wherein a width of the transport path is variable, the cleaning nozzle is one of two cleaning nozzles arranged, one behind the other, so as to extend in respective perpendicular directions toward the center from at least one side of the transport path, and the moving means moves at least one of the two cleaning nozzles.
2. A die bonder comprising:
conveying means for conveying a substrate along a transport path;
a coating unit for applying an adhesive to the substrate while the substrate is conveyed along the transport path;
a bonding means for bonding a substrate die picked from the wafer to a part coated with the adhesive; and
a foreign substance removing device for removing foreign matter on the substrate provided upstream of the coating unit;
wherein the foreign substance removing device comprises a cleaning nozzle integrating an air outlet orifice and an air inlet orifice, and a moving means for moving the cleaning nozzle at a distance from the substrate according to the size of the substrate in a direction perpendicular to a direction in which the substrate is conveyed;
wherein the air inlet orifice is provided so as to surround the air outlet orifice;
wherein the air outlet orifice is one of a plurality of air outlet orifices, and wherein the cleaning nozzle is provided with the plurality of air outlet orifices in a row; and
wherein a width of the transport path is variable, the cleaning nozzle is one of two cleaning nozzles arranged, one behind the other, so as to extend in respective perpendicular directions toward the center from at least one side of the transport path, and the moving means moves at least one of the two cleaning nozzles.
3. The die bonder according to claim 1 , further comprising a fixed cleaning nozzle that has an air outlet orifice and an air inlet orifice in the same manner as the cleaning nozzle, extends on a perpendicular direction, and is fixed above a central portion of the transport path and before or after the cleaning nozzle that is moved by the moving means in the direction in which the substrate is conveyed.
4. The die bonder according to claim 2 , further comprising a fixed cleaning nozzle that has an air outlet orifice and an air inlet orifice in the same manner as the cleaning nozzle, extends on a perpendicular direction, and is fixed above a central portion of the transport path and before or after the cleaning nozzle that is moved by the moving means in the direction in which the substrate is conveyed.