IP Library Assignment 026173/0374
Patent Assignment
Reel/Frame 026173/0374

Assignment of Assignor's Interest

Recorded: 2011-04-25 Pages: 8
Assignors
BACHMAN, MARK A.
Executed: 2006-07-19
BITTING, DONALD S.
Executed: 2006-06-27
CHITTIPEDDI, SAILESH
Executed: 2006-06-21
KANG, SEUNG H.
Executed: 2006-07-14
MERCHANT, SAILESH M.
Executed: 2006-07-07
Assignee
AGERE SYSTEMS INC.
1110 AMERICAN PARKWAY, NE, ALLENTOWN, PENNSYLVANIA, 18109
Covered Property (1)
Solder Bump Structure for Flip Chip Semiconductor Devices and Method of Manufacture Therefore
Patent: 8,507,317 →
Application: 13/093,032 →
Publication: US 2011/0195544
Related Assignments (10)
Other recorded transfers of the patent in this record — the chain of ownership.
Certificate of Conversion Apr 22, 2013
From: AGERE SYSTEM INC.
To: AGERE SYSTEMS LLC
Reel/Frame 030260/0394 →
Corrective Assignment to Correct the Assignee Address Previously Recorded on Reel 030260 Frame 0394. Assignor(S) Hereby Confirms the 1621 Barber Lane Milpitas, California 95035. May 7, 2013
From: AGERE SYSTEM INC.
To: AGERE SYSTEMS LLC
Reel/Frame 030370/0031 →
Patent Security Agreement May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →
Assignment of Assignor's Interest Apr 3, 2015
From: AGERE SYSTEMS LLC
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035365/0634 →
Termination and Release of Security Interest in Patent Rights (Releases Rf 032856-0031) Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
Patent Security Agreement Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
Termination and Release of Security Interest in Patents Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
Assignment of Assignor's Interest Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044886/0766 →
Security Interest Feb 1, 2018
From: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
To: CORTLAND CAPITAL MARKET SERVICES LLC, AS COLLATERAL AGENT
Reel/Frame 045216/0020 →
Release of Security Interest Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 059723/0382 →