Patent Assignment
Reel/Frame 026182/0659
Assignment of Assignor's Interest
Recorded: 2011-04-26
Pages: 4
Assignor
CHINO, TERUAKI
Executed: 2011-04-22
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI,, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Semiconductor Package and Method of Manufacturing Same