Semiconductor package and method of manufacturing same

1. A method of manufacturing a semiconductor package, comprising:

preparing a supporting body having a plurality of recesses provided on a surface thereof;

placing a plurality of semiconductor chips with a single one of the semiconductor chips in each of the recesses provided on the surface of the supporting body so that the semiconductor chips have respective parts thereof projecting from the corresponding recesses;

forming a resin part on the surface of the supporting body, the resin part encapsulating the projecting parts of the semiconductor chips;

removing the supporting body;

forming an interconnection structure electrically connected to the semiconductor chips by using the resin part as a part of a base body of the semiconductor package; and

obtaining a plurality of semiconductor packages by cutting the interconnection structure and the resin part after said forming the interconnection structure, so that each of the semiconductor packages includes at least one of the semiconductor chips.

2. The method as claimed in claim 1 , wherein:

said placing the plurality of semiconductor chips places the semiconductor chips so that respective circuit surfaces of the semiconductor chips face toward respective inside bottom surfaces of the corresponding recesses;

said forming the resin part covers respective surfaces of the semiconductor chips opposite to the respective circuit surfaces with a first resin part;

said removing the supporting body exposes the circuit surfaces of the semiconductor chips from a surface of the first resin part; and

said forming the interconnection structure includes

forming a second resin part covering the surface of the first resin part and the circuit surfaces of the semiconductor chips;

removing a part of the second resin part which part covers the circuit surfaces of the semiconductor chips; and

forming an insulating layer and an interconnection layer on the second resin part and on the circuit surfaces of the semiconductor chips.

3. The method as claimed in claim 2 , wherein:

the second resin part includes a photosensitive resin, and

said removing the part of the second resin part removes the part of the second resin part by photolithography.

4. The method as claimed in claim 2 , wherein said forming the interconnection structure comprises

forming the insulating layer on the second resin part and on the circuit surfaces of the semiconductor chips;

forming a plurality of via holes in the insulating layer to expose respective electrodes of the semiconductor chips; and

forming the interconnection layer on the insulating layer, wherein the interconnection layer includes a plurality of vias that are provided in the respective via holes so as to be connected to the electrodes.

5. The method as claimed in claim 1 , further comprising:

exposing a part of each of respective circuit surfaces of the semiconductor chips from a first surface of the resin part by grinding the first surface of the resin part after said forming the resin part,

wherein said placing the plurality of semiconductor chips places the semiconductor chips so that respective surfaces of the semiconductor chips opposite to the respective circuit surfaces face toward respective inside bottom surfaces of the corresponding recesses,

said forming the resin part covers the circuit surfaces of the semiconductor chips with the resin part,

said removing the supporting body exposes the surfaces of the semiconductor chips opposite to the circuit surfaces from a second surface of the resin part, and

said forming the interconnection structure forms the interconnection structure including an insulating layer and an interconnection layer on the first surface of the resin part and on the parts of the circuit surfaces of the semiconductor chips.

6. The method as claimed in claim 5 , wherein:

a bump electrode is formed at each of the circuit surfaces of the semiconductor chips, and

said exposing the part of each of the respective circuit surfaces exposes a respective surfaces of the bump electrodes from the first surface of the resin part by grinding the first surface of the resin part.

7. The method as claimed in claim 5 , wherein said forming the interconnection structure comprises

forming the insulating layer on the first surface of the resin part and on the parts of the circuit surfaces of the semiconductor chips;

forming a plurality of via holes in the insulating layer to expose respective electrodes of the semiconductor chips; and

forming the interconnection layer on the insulating layer, wherein the interconnection layer includes a plurality of vias that are provided in the respective via holes so as to be connected to the electrodes.

8. The method as claimed in claim 1 , wherein said forming the resin part forms the resin part by resin molding.

9. The method as claimed in claim 1 , wherein:

the supporting body is metallic, and

said removing the supporting body removes the supporting body by etching.

10. The method as claimed in claim 1 , wherein the semiconductor chips have the respective parts thereof projecting out of the corresponding recesses.

11. The method as claimed in claim 1 , further comprises:

forming an external connection terminal on the interconnection structure,

wherein said forming the interconnection structure includes

forming an insulating layer; and

forming an interconnection layer on the insulating layer, and

wherein the external connection terminal is formed on the interconnection layer.

12. The method as claimed in claim 1 , wherein said forming the interconnection structure comprises

forming a plurality of insulating layers and a plurality of interconnection layers in alternate layers.