Assignment of Assignor's Interest

Recorded: 2011-04-27 Pages: 2

Assignor

SAKURAI, TETSUO

Executed: 2011-04-18

Assignee

SHOWA DENKO K.K.

13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 1058518, JAPAN

Covered Property (1)

Compound Semiconductor Manufacturing Device, Compound Semiconductor Manufacturing Method, and Jig for Manufacturing Compound Semiconductor

Patent: 8,591,656 →

Application: 13/126,110 →

Publication: US 2011/0207299

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.