Patent Assignment
Reel/Frame 026194/0354
Assignment of Assignor's Interest
Recorded: 2011-04-28
Pages: 3
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-EUP, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip and Semiconductor Package with Stack Chip Structure