Patent Assignment
Reel/Frame 026204/0393
Assignment of Assignor's Interest
Recorded: 2011-04-29
Pages: 3
Assignors
GAN, KAH WEE
Executed: 2011-04-25
JIN, YONGGANG
Executed: 2011-04-25
LIU, YUN
Executed: 2011-04-25
HUANG, YAOHUANG
Executed: 2011-04-25
Assignee
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property
(1)
Through Hole via Filling Using Electroless Plating
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.