Patent Assignment
Reel/Frame 026225/0642
Assignment of Assignor's Interest
Recorded: 2011-05-04
Pages: 3
Assignors
TSUNO, TAKESHI
Executed: 2011-04-25
GOTO, TAKAYUKI
Executed: 2011-04-25
KINOUCHI, MASATO
Executed: 2011-04-25
IDE, KENSUKE
Executed: 2011-04-25
SUZUKI, TAKENORI
Executed: 2011-04-25
Assignee
MITSUBISHI HEAVY INDUSTRIES
16-5, KONAN 2-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Wafer Bonding Device and Wafer Bonding Method
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Name of the Assignee Previously Recorded on Reel 026225 Frame 0642. Assignor(S) Hereby Confirms the Assignment.
Nov 2, 2015
From: TSUNO, TAKESHI; GOTO, TAKAYUKI; KINOUCHI, MASATO; IDE, KENSUKE
To: MITSUBISHI HEAVY INDUSTRIES, LTD.
Reel/Frame 037033/0195 →
Assignment of Assignor's Interest
Jun 7, 2016
From: MITSUBISHI HEAVY INDUSTRIES, LTD.
To: MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
Reel/Frame 038896/0534 →