Patent Assignment
Reel/Frame 026237/0315
Assignment of Assignor's Interest
Recorded: 2011-05-06
Pages: 5
Assignors
UPADHYAYULA, SURESH
Executed: 2011-05-03
LEE, MING HSUN
Executed: 2011-05-04
TAKIAR, HEM
Executed: 2011-05-03
Assignee
SANDISK TECHNOLOGIES INC.
TWO LEGACY TOWN CENTER, 6900 NORTH DALLAS PARKWAY, PLANO, TEXAS, 75024
Covered Property
(1)
Col-Based Semiconductor Package Including Electrical Connections Through a Single Layer Leadframe
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038807/0850 →
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Assignment of Assignor's Interest
Apr 8, 2025
From: SANDISK TECHNOLOGIES, INC.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 070776/0307 →