Merger

Recorded: 2011-06-02 Pages: 6

Assignor

RENESAS TECHNOLOGY CORP.

Executed: 2010-04-16

Assignee

NEC ELECTRONICS CORPORATION

1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN

Covered Property (1)

Wiring Glass Substrate for Connecting a Semiconductor Chip to a Printed Wiring Substrate and a Semiconductor Module Having the Wiring Glass Substrate

Patent: 7,535,106 →

Application: 11/657,280 →

Publication: US 2007/0114653

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.