Patent Assignment
Reel/Frame 026398/0809
Assignment of Assignor's Interest
Recorded: 2011-06-07
Pages: 3
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG,, HSINCHU, 31040, TAIWAN
Covered Property
(1)
Three Dimensional Stacked Chip Package Structure