IP Library Assignment 026446/0647
Patent Assignment
Reel/Frame 026446/0647

Assignment of Assignor's Interest

Recorded: 2011-06-15 Pages: 4
Assignors
ESTES, JOHN C.
Executed: 2003-05-08
LUCERO, RODOLFO
Executed: 2003-05-08
PAVIO, ANTHONY M.
Executed: 2003-05-08
Assignee
MOTOROLA, INC.
1303 ALGONQUIN ROAD, IL-01 11TH FLOOR, SCHAUMBURG, ILLINOIS, 60196
Covered Property (1)
Localized Enhancement of Multilayer Substrate Thickness for High Q Rf Components
Patent: 7,221,244 →
Application: 11/237,056 →
Publication: US 2006/0027385
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jun 15, 2011
From: MOTOROLA, INC
To: MOTOROLA SOLUTIONS, INC.
Reel/Frame 026446/0677 →